Applied Filters:
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap Filler
05/30/2567
05/30/2567
Silicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®
05/27/2567
05/27/2567
Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.
Bergquist Company Data Centre Applications
04/01/2566
04/01/2566
Advanced materials help with thermal management, long-term reliability, and stress protection.
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal Gel
07/11/2565
07/11/2565
Assures high thermal conductivity, good dispensing efficiency, and high thermal reliability.
Bergquist Company EV Charging Solutions
04/13/2565
04/13/2565
Designed to provide safe charging while protecting EV battery packs from thermal/electrical events.
Viewing: 1 - 5 of 5
Bourns BTJ Thermal Jumper Chips
02/02/2569
02/02/2569
Unique surface-mount components that provide high thermal conductivity for thermal dissipation.
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™
11/06/2568
11/06/2568
Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.
Laird Technologies Tflex™ HR6.5 Thermal Gap Filler
09/15/2568
09/15/2568
Thermal interface material with >6W/mK thermal conductivity with high recovery properties.
Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap Fillers
09/09/2568
09/09/2568
Provide high thermal conductivity, low thermal resistance, and high reliability.
Laird Technologies Tputty™ SF560 1-Part Dispensable Gap Fillers
08/25/2568
08/25/2568
Designed to offer thermal conductivity of 5.6W/mK, along with superior thermal resistance.
Laird Technologies Tflex™ CR550 2-Part Dispensable Gap Filler
10/25/2567
10/25/2567
Transfers unwanted heat in automotive components and the A+B putty material cures in place.
Laird Technologies Tflex SF4 Thermal Gap Fillers
09/10/2567
09/10/2567
Silicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.
Laird Technologies Tflex SF7 Thermal Gap Fillers
09/10/2567
09/10/2567
Innovative, high-performing thermal material with silicone-free construction.
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap Filler
05/30/2567
05/30/2567
Silicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®
05/27/2567
05/27/2567
Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip Resistors
01/18/2567
01/18/2567
Features chip sizes ranging from 0603 to 2512.
MG Chemicals Non-Silicone Liquid Thermal Gel
10/30/2566
10/30/2566
1-part gel that offers extreme thermal conductivity and flame retardancy.
LeaderTech TCF Ultra-Thin Carbon Fibre Thermal Pads
10/18/2566
10/18/2566
Low thermal resistance, soft surface, and mainly uses carbon fibre as a thermally conductive filler.
LeaderTech TGN Ultra-Thin Thermal Pads
10/18/2566
10/18/2566
Features low thermal resistance and is manufactured by combining graphene and silicone.
LeaderTech TCI Composite Indium Sheet
10/18/2566
10/18/2566
Transitions from solid to liquid at its melting point and back to solid again at room temperature.
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal Grease
09/27/2566
09/27/2566
Feature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.
Wakefield Thermal 127-6 High-Performance, Sil-Free Thermal Grease
09/13/2566
09/13/2566
High-performance, non-silicone thermal grease syringe with 6W/m-K thermal conductivity.
Laird Technologies CoolZorb 200 Hybrid TIM/EMI Absorbers
09/08/2566
09/08/2566
Hybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.
Bergquist Company Data Centre Applications
04/01/2566
04/01/2566
Advanced materials help with thermal management, long-term reliability, and stress protection.
Laird Technologies Tflex™ HD7.5 Thermal Gap Filler
08/03/2565
08/03/2565
Soft silicone material that offers high deflection and 7.5W/mK thermal conductivity.
Laird Technologies Tpcm™ 7000 High-Performance TIMs
08/03/2565
08/03/2565
Designed to enhance the cooling of the thermal challenges in electronics.
Laird Technologies Tpcm™ 5000 High-Performance TIM
07/19/2565
07/19/2565
Features low thermal resistance and a non-silicone formulation with a naturally tacky surface.
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal Gel
07/11/2565
07/11/2565
Assures high thermal conductivity, good dispensing efficiency, and high thermal reliability.
Laird Technologies Ttape™ 1000A Thermally Conductive Tape
06/03/2565
06/03/2565
Pressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.
Bergquist Company EV Charging Solutions
04/13/2565
04/13/2565
Designed to provide safe charging while protecting EV battery packs from thermal/electrical events.
Viewing: 1 - 25 of 27