Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal Gel efficiently manages heat dissipation and accommodates mass production demands for high-temperature devices. The interface material is a red, pre-cured, one-part gel that requires no mixing or refrigeration and offers 10.0W/m-K thermal conductivity. Operating between -60°C to +200°C, the Liqui-Form TLF 10000 10W/m-K Thermal Gel's formulation ensures a balanced mix of high thermal conductivity, good-dispensing efficiency, and high-thermal reliability. This material is specially designed to provide an effective electronic component cooling capability for 5G base stations and remote antenna assemblies, requiring highly-reliable vertical gap stability. Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal Gel comes in a 150cc cartridge and a 0.8-gallon pail.
