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Bench Talk for Design Engineers

Bench Talk

Bench Talk for Design Engineers | The Official Blog of Mouser Electronics

High-Density Backplane Connectors for PCIe Gen 6

On December 17, 2025 in Computing, Connectors, Industrial, Power by Amphenol

As data centers push toward PCIe Gen 6 performance, engineers face new challenges. Amphenol TCS HD Express® Interconnect System is a high-density backplane connector solution designed to deliver high-speed reliability and scalability for next-generation server and storage systems.

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Tagged With: amphenol hd express, crosstalk reduction, data center interconnect, high-density backplane, high-speed connectors, modular interconnect systems, pcie gen 6 connectors, server backplane design, signal integrity, thermal management

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Copyright ©2026 Mouser Electronics, Inc.

Mouser® and Mouser Electronics® are trademarks of Mouser Electronics, Inc. in the U.S. and/or other countries. All other trademarks are the property of their respective owners. Corporate headquarters and logistics centre in Mansfield, Texas USA.