Bergquist Company Router Switch & Network Applications
Bergquist Company Router Switch and Network Applications include phase change materials and thermally conductive adhesives designed to dissipate heat away from thermally sensitive components. The utilization of advanced materials in server motherboards and line cards for routers and switches offers benefits such as scale and cost reduction. One small uptick in performance, repeated thousands of times, provides a notable impact on router and switch performance. Thermal products from Bergquist Company help components properly function for optimal operation.
Thermal Management Materials
Thermal GAP PAD® Materials
GAP PAD Family Microsite
TGP HC3000 Series, 3W/m-K, High Compliance Soft
TGP HC5000 Series, 5W/m-K, Highly Conformable Soft
TGP 3000ULM Series, 3W/m-K, Extremely Soft
TGP 3500ULM Series, 3.5W/m-K, Extremely Soft
TGP 6000ULM Series, 6W/m-K, Extremely Soft
TGP 7000ULM Series, 7W/m-K, Extremely Soft
TGP 10000ULM Series, 10W/m-K, Extremely Soft
TGP 12000ULM Series, 12W/m-K, Extremely Soft
Thermally Conductive Adhesives
Liqui-Bond TLB 400SLT Series, 4W/m-K
Liqui-Bond TLB EA1800 Series, 1.8W/m-K
Liqui-Bond TLB SA3500 Series, 3.5W/m-K
Thermal Phase Change Materials
Hi-Flow THF 1600G Series, 1.6W/m-K
Hi-Flow THF 5000UT Series, 5.3W/m-K
เผยแพร่แล้ว: 2567-04-22
| อัปเดตแล้ว: 2567-07-05
