STMicroelectronics ISM330DHCX iNEMO Inertial SiP Module

STMicroelectronics ISM330DHCX iNEMO Inertial System-in-Package (SiP) Module features a high-performance 3D digital accelerometer and a 3D digital gyroscope for the Industrial Internet of Things (IIoT) and Industry 4.0 applications. The sensing elements of the accelerometer and gyroscope are implemented on the same silicon die, ensuring superior stability and robustness. The ISM330DHCX has a full-scale acceleration range of ±2g to ±16g and a wide angular rate range of ±125dps to ±4000dps, allowing usage in a broad range of applications. The ISM330DHCX Module integrates a full set of embedded functions and interrupts, including tilt detection, free-fall, wakeup, 6D/4D orientation, click, and double click. An integrated pedometer, with step detection and counter, is included for healthcare applications. STMicroelectronics ISM330DHCX iNEMO Inertial SiP Module is offered in a 14-lead plastic land grid array (LGA) ECOPACK® package and is RoHS compliant.

Features

3D accelerometer with selectable ±2g, ±4g, ±8g, and ±16g full scale
3D gyroscope with extended selectable ±125dps, ±250dps, ±500 dps, ±1000dps, ±2000dps, and ±4000dps full scale
-40°C to +105°C operating temperature range
Embedded compensation for high stability over temperature
SPI/I²C serial interface
Auxiliary SPI serial interface for data output of gyroscope and accelerometer (OIS And other stabilization applications)
Six-channel synchronized output
Sensor hub feature to efficiently collect data from additional external sensors
Embedded smart FIFO up to 9Kbytes

Programmable finite state machine to process data from accelerometer, gyroscope, and external sensors
Machine learning core
Smart embedded functions and interrupts: Tilt Detection, Free-Fall, Wakeup, 6D/4D Orientation, Click, and Double-Click
Embedded pedometer, step detector, and counter for healthcare applications
1.71V to 3.6V analog supply voltage
Embedded temperature sensor
Embedded self-test both for gyroscope and accelerometer
High shock survivability
2.5mm x 3mm x 0.83mm LGA-14 package
ECOPACK, RoHS, and Green compliant