Infineon Technologies EasyPACK™ TRENCHSTOP™ IGBT7 Modules

Infineon Technologies EasyPACK™ TRENCHSTOP™ IGBT7 Modules are based on the latest micro-pattern trenches technology. This provides reduced losses and offers a high level of controllability. The chip is specially optimized for industrial drives applications. The modules offer lower static losses, higher power density and softer switching. A significant increase of power density can be obtained by raising the allowed maximum operation temperature up to 175°C in the power module.


  • LowVCEsat
  • Trenchstop IGBT7
  • Overload operation up to +175°C
  • High power density
  • Compact design
  • Press-fit contact technology


  • Auxiliary inverters
  • Air conditioning
  • Motor drives
  • Servo drives
  • Uninterruptible Power Supply (UPS) systems
เผยแพร่แล้ว: 2563-03-10 | อัปเดตแล้ว: 2565-12-23