EDAC Communication Interconnect Solutions
EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.
Features
- Robust EMI/RFI shielding to protect from interference in dense electronic environments
- Compact and high-density connectors suitable for space-constrained racks and telecom enclosures
- Designed for durability with high mating cycles, ideal for modular upgrades and maintenance
- IP-rated options available for telecom towers and outdoor network gear
- Customizable configurations to support hybrid data/power needs and evolving network architectures, such as 5G and edge computing equipment
Applications
- Data centers
- Communication nodes
- Phone systems
- Smart building IoT
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