Bergquist Company TGP 2202SF Silicone-Free GAP PAD®

Bergquist TGP 2202SF Silicone-Free GAP PAD® are high-performance, 2.0W/m-K, thermally conductive gap filling material that is silicone-free by design and offers exceptionally low interfacial resistances to adjacent surfaces. The gap pads are specifically designed for silicone-sensitive applications. The material’s construction features a 0.5mil PET film on one side and a natural tack on the other. The natural tack eliminates the need for an additional adhesive layer. The Bergquist TGP 2202SF Silicone-Free GAP PAD® are available in sheet form and are gray in appearance. Typical thermal management applications include hard drives, set-top boxes, and optical applications.

Features

  • Silicone-free formulation
  • Minimal compression set
  • 0.5mil film provides tack-free surface
  • Tacky side allows for ease of handling and placement

Applications

  • Hard drives
  • Optical applications
  • Set-top boxes

Specifications

  • Gray color
  • 0.5mil PET film reinforcement carrier
  • 0.254mm to 3.175mm thickness range
  • 1 (2-sided) inherent surface tack
  • -40°C to +125°C operating temperature range
  • 2.8g/cc density
  • UL94V-0 flammability rating
  • 2.0W/(m-k) thermal conductivity
  • 1 x 1011Ω-meter volume resistivity

Application Example

Bergquist Company TGP 2202SF Silicone-Free GAP PAD®
เผยแพร่แล้ว: 2564-04-08 | อัปเดตแล้ว: 2565-11-28