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Stamp-S3Bat & Stamp-S3Bat DIP Core Modules

M5Stack Stamp-S3Bat and Stamp-S3Bat DIP Core Modules come with integrated power management and ESP32-S3-PICO-1-N8R8 as the main control core. These embedded core modules provide 11 GPIOs, 2.4GHz Wi-Fi^®, 8MB flash, 8MB PSRAM, and a 24P BTB connector (supporting the DVP interface). The Stamp-S3Bat and Stamp-S3Bat DIP modules feature a built-in M5MP1 multi-level power control design, power input/output control, lithium battery charging management, and status detection. These modules support external low-power wakeup, an onboard programmable RGB LED, and a 2.54mm standard-pitch half-hole pad design. The Stamp-S3Bat DIP version comes with pre-soldered 2.54mm standard pitch headers, allowing integration into applications via PCB insertion, Dupont cables, or breadboard connection. The Stamp-S3Bat and Stamp-S3Bat DIP modules support both SMT and DIP integration methods, making them ideal for developers to build IoT applications quickly.

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