Tflex™ SF800 Thermal Gap Filler

Laird Technologies Tflex™ SF800 Thermal Gap Filler is a high-performance, silicone-free, thermally conductive gap pad. This series combines high thermal conductivity with exceptional wetting characteristics to provide low thermal resistance. Laird Technologies Tflex SF800 Thermal Gap Filler is RoHS and REACH compliant. The SF800 series is ideally used in applications where silicone-based pads are traditionally used and in silicone-sensitive applications.